EM MICROELECTRONIC-MARIN SAH4005
ISO 11'784 / 11'785 COMPLIANT READ ONLY
CONTACTLESS IDENTIFICATION DEVICE
Features
• 128 bit memory array laser programmable• Bit duration : 32 periods of RF field• Bit coding according to ISO FDX-B• On chip resonnance capacitor• On chip supply buffer capacitor• Wide dynamic range• On chip voltage limiter• Full wave rectifier
• Large modulation depth
• Operating frequency 100 - 150 kHz
• Very small chip size convenient for implantation• Very low power consumption
Typical Operating Configuration
Coil 2LH4005Coil 1Description
The H4005 is a CMOS integrated circuit intented for use inelectronic Read Only RF Transponders. The circuit ispowered by an external coil placed in an electromagneticfield, and gets its master clock from the same field via one ofthe coil terminals. The other coil terminal is affected by themodulator. By turning on and off the modulation current, thechip will send back the 128 bits of information contained in afactory pre-programmed memory array.
The programming of the chip is performed by laser fusing ofpolysilicon links in order to store a unique code on each chip.Due to the low power consumption of the logic core, nosupply buffer capacitor is required. Only an external coil isneeded to obtain the chip function. A parallel resonancecapacitor of 75 pF is also integrated.
Fig. 1Pin Assignment
COIL2H4005COIL1VSSVDDApplications
• Animal implantable transponder• Animal ear tag
• Industrial transponder
COIL 1 Coil terminal / Clock inputCOIL 2 Coil terminalFig. 21
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EM MICROELECTRONIC-MARIN SAAbsolute Maximum Ratings
Parameter
Maximum AC peak Current induced on COIL1 and COIL2
H4005
SymbolTopICOILVcoilfcoil
100
14*
150
Min.-40
Typ.
Max.Units+8510
°CmAVppkHzTable 2
Operating Conditions
Parameter
Operating TemperatureMaximum coil current
SymbolConditions
ICOIL
± 30 mA
Power SupplyVDD-0.3 to 7.5 V
AC Voltage on CoilSupply Frequency
Storage temperature
Electrostatic discharge maximumto MIL-STD-883C method 3015
Tstore-55 to +200°C
VESD1000 V
*) The AC Voltage on Coil is limited by the on chip voltagelimitation circuitry.
Table 1
Stresses above these listed maximum ratings may causepermanent damage to the device.
Exposure beyond specified operating conditions may affectdevice reliability or cause malfunction.
Handling Procedures
This device has built-in protection against high static voltages orelectric fields; however due to the unique properties of thisdevice, anti-static precautions should be taken as for any otherCMOS component.
System PrincipleFig. 3TransceiverTransponderOscillatorAntennaDriverCoil 1H4005DataDecoderFilter &GainDemodulatorCoil 2Data receivedfrom transponderSignals on coilsSignal onTransponder coilSignal onTransceiver coilRF CarrierData2
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EM MICROELECTRONIC-MARIN SAElectrical Characteristics
H4005
Min.
1.5
VDD = 1.5 V VSS = 0 V fcoil = 134 kHz Sine wave Top = 25°C
VC1 = 1.0 V with positive peak at VDD and negative peak at VDD - 1 V unless otherwise specified
Parameter
Supply VoltageSupply Current
Rectified Supply VoltageC2 pad Modulator ON voltage drop
C1 pad Modulator ON voltage drop
Coil1 - Coil2 capacitancePower Supply Capacitor
Symbol
VDDIDDVDDVONC2
Test Conditions
Typ.Max.Units
1)
VµAV
1.5
VC2 -VC1 = 2.8 VDC Modulator Switch = \"ON\"VDD = 1.5V IVDDC2 = 100 µA with ref. to VDDVDD = 5.0V IVDDC2 = 1 mA with ref. to VDDVDD = 5.0V IVDDC1 = 1 mA with ref. to VDD
Vcoil = 100 mVRMS f = 10 kHz
1.50.92.12.1
1.33.03.0
VVV
VONC1
CresCsup
75 2)150
pFpFTable 3
1) The maximum voltage is defined by forcing 10 mA on C1 - C2
2) The toleranceof the resonant capacitor is ± 15 % over the whole production. On a wafer basis and on process statistics, the tolerance is ± 2%
Timing Characteristics
VDD = 1.5 V VSS = 0 V fcoil = 134 kHz Sine wave Top = 25°C
VC1 = 1.0 V with positive peak at VDD and negative peak at VDD - 1 V unless otherwise specifiedTimings are derived from the field frequency and are specified as a number of RF periods.Parameter
Read Bit Period
Symbol
trdb
Test Conditions Value
32
Units
RF periods
Timing Waveforms TOC32TOCTable 4Fig. 4COIL1Serial Data OutBIT nBIT n+1BIT n+2Binary Data01101001Memory OutputModulator Output3
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EM MICROELECTRONIC-MARIN SABlock Diagram
CLOCKEXTRACTORLogicClockCOIL1AC1 FULL WAVERECTIFIERAC2SEQUENCERVDDH4005
CresCsupMEMORYARRAYCOIL2VSSDATAMODULATORSerialData outModulationControlDATAENCODERFig. 4Functional Description
General
The H4005 is supplied by means of an electromagnetic fieldinduced on the attached coil. The AC voltage is rectified in orderto provide a DC internal supply voltage. When the DC voltage issufficient the chip sends data continuously. When the last bit issent, the chip will continue with the first bit until the power goesoff.
Full Wave Rectifier
The AC input induced in the external coil by an incidentmagnetic field is rectified by a Graetz bridge. The bridge will limitthe internal DC voltage to avoid malfunction in strong fields.Clock extractor
One of the coil terminals (COIL1) is used to generate the masterclock for the logic function. The output of the clock extractordrives a sequencer.
Sequencer
The sequencer provides all necessary signals to address thememory array and to encode the serial data out. The data rate isset to 32 clocks per bit.
Data Encoder
The data is coded according to the FDX-B scheme. At thebeginning of each bit, a transition will occur. A logic bit \"1\" willkeep its state for the whole bit duration and a logic bit \"0\" willshow a transition in the middle of the bit duration (refer to fig. 4).The FDX-B allows an advance of up to 8 clocks in the ON toOFF transition. Due to its low power consumption, there is nodifference in performance for the H4005 when implementing atransition advance. No clock advance is provided on thestandard version.
Data Modulator
The data modulator is controlled by the signal ModulationControl in order to induce a high current on COIL2 terminalwhen this signal is at logic \"0\". This will affect the magnetic fieldaccording to the data stored in the memory array.
Memory
The memory contains 128 bits laser programmed duringmanufacturing according to a customer list of codes. The bitsare read serially in order to control the modulator. The 128 bitsoutput sequence is repeated continuously until power goes off.Memory Map
128 bit pattern ISO 11785Send bit 1 first111 12Identification code64 + 8 bits83 84101 102CRC16 + 2 bitsExtension24 + 3 bits128Header11 bitsNational codeCountryReserved64Send first27 2617 16 152 164 bit pattern Identification code ISO 11784Fig. 54元器件交易网www.cecb2b.com
EM MICROELECTRONIC-MARIN SAMemory organisation
The structure of the 128 bits is as follows :
H4005
The header is sent first and is used to identify the start of the sequence. It is composed of 11 bits having a bit pattern which isunique in the data stream. 00000000001
The header is followed by the Identification code which is composed of 64 bits organised in 8 blocks of 8 bits. Each block of8 bits is trailed by a control bit set to logic \"1\" to prevent that the header is reproduced in the data. Bit 64 is transmitted first.Bit 1 is a flag for animal \"1\" or non-animal \"0\" application.Bits 2-15 are a reserved code for future use.
Bit 16 is a flag for additional data block \"1\" or no additional data block \"0\".Bits 17-26 ISO 3166 Numeric country codeBits 27-64 National identification code
The next two 8 bit blocks contain the 16 CRC-CCITT error detection bits. LSB is transmitted first, and the 2 block are trailedwith with a binary \"1\".
The data stream with 3 blocks of 8 bits trailed with a logical \"1\" representing the extension bits. The extension bits areplanned for future extension in which for instance information from sensors or contents of trailing pages may be stored. In thecurrent version the standard coding will be 000000001 000000001 000000001 and the flag bit 16 of the identification code\"0\".
Resonance Capacitor
The Resonance Capacitor is integrated, and its value is typically 75 pF.
Typical Capacitor Variation
versus Temperature
Cr Tolerance [%]
100.3100.2100.1100.099.999.899.7
-50
-30
-10
10
30
50
70
90100.7
Temperature [°C]
Fig. 6
Pad DescriptionPad1234NameCOIL2COIL1VDDVSSFunctionCoil Terminal 2 / Data outputCoil Terminal 1 / Clock inputPositive Internal Supply VoltageNegative Internal Supply Voltage1423Table 55
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EM MICROELECTRONIC-MARIN SAPackage and Ordering Information
Dimensions of PCB version
CHIP Dimensions
1118355150COIL21016COIL18.0150H4005
137137VSSH4005H4005VDD1181181380137160137COIL2VSS4.01.01016200325200160H4105 BumpedCOIL1VDD11811895Dimensions in [mm]600Fig. 7IC Thickness : 280 µm ± 25 µmBump Height : 25 µm ± 5 µm Dimensions in µmFig. 8Ordering Information
The H4005 is available in chip form without Bumps in chip form with Bumps PCB
H4005 IC
H4105 Bumped ICH4005 COB
EM MICROELECTRONIC-MARIN SA cannot assume responsibility for use of any circuitry described other than circuitry entirely embodied in an EMMICROELECTRONIC-MARIN SA product.
EM MICROELECTRONIC-MARIN SA reserves the right to change the circuitry and specifications without notice at any time. You are strongly urged to ensure thatthe information given has not been superseded by a more up to date version.
© 1997 EM Microelectronic-Marin SA, 11/97 Rev. C/190
EM MICROELECTRONIC-MARIN SA , 2074 Marin, Switzerland, Tel. +41 32 755 5111, Fax +41 32 755 5403
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